Rydon Technology Ltd

TRANSFER MOLDING SYSTEMS

Automatic Transfer Molding Systems for controlled moulding of:

• Single Units
• Leadframe based products
• BGA and similar laminate substrate products
• Continuous Strip Leadframes

Future Packages (supported by Fico's Material & Process Research (MPR) Department for the design and development of new packages and processes)

Manufactured by Fico Molding Systems.

Fico website: www.besi.com

Rydon Technology Ltd in partnership with Accelonix Ltd represents Fico Bv for the supply of Moulding Equipment in the UK and Ireland territories only.

TRIM & FORM INTEGRATION SYSTEMS

Flexible modular high output production systems for Trim and Form with output into bulk, tubes or trays of:

Power & Discrete Packages

• High Pin Count Semiconductors (TQFP, QFP, SOIC, SOJ, PLCC)
• Leadless Packages (QFN)
• Memory Modules (MMC)
• Continuous Strip Based Packages (SOT)

Including Integration with:

• Laser Marking
• Laser Deflashing
• Laser Cutting
• Strip Based Test Handler
• Other Production Process Equipment

All designed and manufactured by Fico Trim & Form Integration Systems.

Rydon Technology Ltd in partnership with Accelonix Ltd represents Fico Bv for the supply of Trim and Form and Integration Equipment in the UK and Ireland territories only.

Fico website: www.besi.com

SINGULATION SYSTEMS

The Meco Interposer Singulation System II Fico ISS for BGA, CSP and QFN products with high speed Device Sorter:

• The Meco interposer singulation system (FICO MISSII) for sawing BGA and QFN

• Designed and manufactured by Fico in the Netherlands

Rydon Technology Ltd in partnership with Accelonix represents Fico Bv for the supply of Singulation Equipment in the UK and Ireland territories only.

Fico Singulation website: www.besi.com